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Micron · Managed NAND

MTFC256GBGBBAP-WT

256GB, UFS TLC, WFBGA, wireless temperature.

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Product datasheetPDF →
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Specifications

Manufacturer
Micron
Interface / type
UFS TLC
Density / capacity
256 GB
Supply voltage
2.5 V
Data width
X8
Data rate
3200 MT/s
Package
WFBGA
Package size (mm)
13.00 x 9.00 x 0.80
Lead count
153/196
Temperature grade
Wireless
Operating temperature
−25 to 85 °C
Protocol version
UFS4.1

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Edge Electronics · Product summary
Micron · MTFC256GBGBBAP-WT

https://www.edgeelectronics.com/p/micron-mtfc256gbgbbap-wt/

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